Micro LED

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*COM (Chip on Module)

Lumens’ new technology of RGB Flip chip on modules provides a better display resolution and high reliability.

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The new COM (Chip on Module) technology of Lumens is the groundbreaking solution for the limit of resolution of the current POM (Package on Module) technology. With the elimination of the main defection of LED (wire bonding), the Flip chip technology of Lumens displays a higher reliability.

Specification

Product Guide

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Module

Model Pixel pitch
[ mm ]
Resolution
[ px ]
Size
[ mm ]
Weight
[ kg ]
Brightness
[ nits, typ. ]
Contrast ratio
[ min. ]
M08 0.8 120 x 120 (14,440) 96 x 96 0.08 3,000 1:100,000
M16 1.6 120 x 60 (7,200) 192 x 96 0.13 2,000 1:100,000

Unit

Model Pixel pitch
[ mm ]
Resolution
[ px ]
Size
[ mm ]
Weight
[ kg ]
Brightness
[ nits, typ. ]
Contrast ratio
[ min. ]
U08 (12 Modules) 0.8 480 x 360 (172,800) 96 x 96 3.2 3,000 1:100,000
U16 (6 Modules) 1.6 240 x 180 (43,200) 192 x 96 2.9 2,000 1:100,000

Set

Model Pixel pitch
[ mm ]
Display size
[ inch ]
Resolution
[ px ]
Size
[ mm ]
Weight
[ kg ]
Brightness
[ nits, typ. ]
Contrast ratio
[ min. ]
FHD08 (12 Units) 0.8 70 1,920 x 1,080 (2,073,600) 1,392 x 864 38 3,000 1:100,000
UHD08 (48 Units) 0.8 139 3,840 x 2,160 (8,294,400) 2,784 x 1,728 154 3,000 1:100,000
FHD16 (48 Units) 1.6 139 1,920 x 1,080 (2,073,600) 2,784 x 1,728 139 2,000 1:100,000
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Documentation

Title Last Modified Download
[Data Sheet] M08 2018-01-30 DOWNLOAD
[Data Sheet] M16 2018-01-30 DOWNLOAD
[Data Sheet] U08 2018-01-30 DOWNLOAD
[Data Sheet] U16 2018-01-30 DOWNLOAD
[Data Sheet] FHD08 2018-01-30 DOWNLOAD
[Data Sheet] UHD08 2018-01-30 DOWNLOAD
[Data Sheet] FHD16 2018-01-30 DOWNLOAD